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Copper Pyrophosphate Cas 10102-90-6

Copper plating with pyrophosphate is widely used in copper plating process, which is used by many plating plants in China. This process is characterized by stable plating solution, fine crystalline layer, better dispersion and coverage ability than acid copper plating.

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Product Name: Copper pyrophosphate

Synonym: Diphosphoric acid copper salt

Molecular Structure:

Specifications:

Item Specifications
CAS No. 10102-90-6
Molecular Formula Cu2O7P2
Molecular Weight 301.04
Appearance Light blue powder
Purity ≥99 %
Water soluble insoluble in water
Density 1.2965 (rough estimate)

Packing: 25kg/Bag

Function: 

Copper plating with pyrophosphate is widely used in copper plating process, which is used by many plating plants in China. This process is characterized by stable plating solution, fine crystalline layer, better dispersion and coverage ability than acid copper plating.

Application: 

1.It is mainly used for cyanide-free plating and is the main salt for supplying copper ions in the plating solution

2.Used as copper underlayer for decorative protective layers and partial anti-carburization coating for carburized parts.

Storage:

Stored in a cool dry and ventilated place

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