Product Name: Copper pyrophosphate
Synonym: Diphosphoric acid copper salt
Molecular Structure:
Specifications:
Item | Specifications |
CAS No. | 10102-90-6 |
Molecular Formula | Cu2O7P2 |
Molecular Weight | 301.04 |
Appearance | Light blue powder |
Purity | ≥99 % |
Water soluble | insoluble in water |
Density | 1.2965 (rough estimate) |
Packing: 25kg/Bag
Function:
Copper plating with pyrophosphate is widely used in copper plating process, which is used by many plating plants in China. This process is characterized by stable plating solution, fine crystalline layer, better dispersion and coverage ability than acid copper plating.
Application:
1.It is mainly used for cyanide-free plating and is the main salt for supplying copper ions in the plating solution
2.Used as copper underlayer for decorative protective layers and partial anti-carburization coating for carburized parts.
Storage:
Stored in a cool dry and ventilated place
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