Description
Molecular Formula: C18H26O6
Molecular Weight: 338.4
Structural Formula:
Specification：
Items
Specifications
Melting Point
-25°C
Boiling Point
>200°C 1mm
Density
1.06g/mL at 25°C (lit.)
Vapor Density
>1(vs air)
Vapor Pressure
<0.01 mmHg(20°C)
Refractive Index
n20/D1.472(lit.)
Flash Point
>230°F
Odor
somewhat ester-like odor
Water Solubility
20.1mg/L at 20°C
Acid Value (mg KOH/g)
≤1
Viscosity at 25℃,cps
40-60
Color (Hazen)
≤50
Items | Specifications |
Melting Point | -25°C |
Boiling Point | >200°C 1mm |
Density | 1.06g/mL at 25°C (lit.) |
Vapor Density | >1(vs air) |
Vapor Pressure | <0.01 mmHg(20°C) |
Refractive Index | n20/D1.472(lit.) |
Flash Point | >230°F |
Odor | somewhat ester-like odor |
Water Solubility | 20.1mg/L at 20°C |
Acid Value (mg KOH/g) | ≤1 |
Viscosity at 25℃,cps | 40-60 |
Color (Hazen) | ≤50 |
Function：
1. High reactivity, can cross-link with polymer molecular chain under the action of heat, light or initiator to form a three-dimensional network structure.
2. In the process of mixing, it has plasticizing effect on rubber material; after vulcanization, it has hardening effect.
3. In some reactions, it can absorb hydrogen halide and other substances, reduce the corrosion of the material and improve the stability and quality of the products.
Application：
1. It is an active agent for the vulcanization of ethylene propylene rubber, EPDM rubber, chlorinated rubber, silicone rubber, polyurethane and other special rubbers.
2. As crosslinking modifier for thermoplastics such as polyethylene, polybutylene, polyvinyl chloride, polypropylene and so on.
3. Used in epoxy acrylate, polyurethane and unsaturated polyester based coatings.
4. Adding in ink can improve the curing speed of ink and the adaptability of ink on different substrates.
5. As a modifier can improve the cohesion and bonding strength of adhesive, can firmly bond different materials such as metal, plastic, glass, etc., and can also regulate the viscosity and tackiness of adhesive.
6. It can be homopolymerized or copolymerized with other heat-resistant monomers, and is used in the manufacture of microelectronic products such as integrated circuits and printed circuit boards and other insulating materials.
7. It can replace divinylbenzene as cross-linking agent of acrylic acid and styrene ion exchange resin, with low dosage, it can prepare new ion exchange resin with excellent performance.
