Description
Molecular Formula:C15H20O6
Molecular Weight:296.32
Structural Formula:
Specification:
Items
Specifications
Melting Point
-66°C
Boiling Point
>200°C
Density
1.1g/mL at 25°C(lit.)
Vapor Density
>1(vsair)
Vapor Pressure
<0.01mmHg(20°C)
Refractive Index
n20/D1.474(lit.)
Flash Point
>230°F
Acidity coefficient(pKa)
0[at20°C]
Specific gravity
1.1
Water solubility
Misciblewithwater
Freezing point
-66
Items | Specifications |
Melting Point | -66°C |
Boiling Point | >200°C |
Density | 1.1g/mL at 25°C(lit.) |
Vapor Density | >1(vsair) |
Vapor Pressure | <0.01mmHg(20°C) |
Refractive Index | n20/D1.474(lit.) |
Flash Point | >230°F |
Acidity coefficient(pKa) | 0[at20°C] |
Specific gravity | 1.1 |
Water solubility | Misciblewithwater |
Freezing point | -66 |
Function:
1. It has strong polymerization activity, and is capable of free radical polymerization reaction, forming polymers with different properties.
2. It can be used as cross-linking agent to improve the cross-linking density of the polymer and enhance the heat resistance, mechanical strength and dimensional stability of the polymer material.
3. Thinning and viscosity reduction functions, making it easier to coat, molding and other operations.
4. Enhance the adhesion between the polymer and the substrate, improve the durability of coating or bonding.
5. Good thermal and chemical stability, good resistance to acid, alkali, solvents and other chemicals.
Application:
1. Commonly used in the manufacture of high-performance UV curing coatings, such as furniture paint, floor paint, automotive paint.
2. It is an important part of UV curing ink, which is widely used in the printing of paper, plastic, metal and other materials, such as food packaging printing, plastic film printing, label printing, etc..
3. Can be used to prepare high-performance UV curing adhesives, widely used in electronic equipment, automotive parts, furniture manufacturing and other areas of adhesive sealing.
4. As a crosslinking agent or modifier for the production of plastics and rubber.
5. It can be used in the preparation of photoresist and electronic packaging materials.
6. It can also be used as irradiation sensitizer and cross-linking agent for cable materials to improve the heat resistance and cross-linking degree of cable materials.
