Description
Molecular Formula: C26H50O4
Molecular Weight: 426.67
Structural Formula:
Specification：
Items
Specifications
Melting Point
18°C
Boiling Point
256°C
Density
0.912
Vapor Pressure
0Pa at 25℃
Refractive index
1.451
Flash Point
210°C
Water Solubility
3.856ng/L at 25℃
Freezing Point
-48℃
Dielectric Constant
4.0(27℃)
Color(APHA)
<40
Items | Specifications |
Melting Point | 18°C |
Boiling Point | 256°C |
Density | 0.912 |
Vapor Pressure | 0Pa at 25℃ |
Refractive index | 1.451 |
Flash Point | 210°C |
Water Solubility | 3.856ng/L at 25℃ |
Freezing Point | -48℃ |
Dielectric Constant | 4.0(27℃) |
Color(APHA) | <40 |
Function：
1. Sebacic Acid Di-N-Octyl Ester has plasticizing function.
2. Sebacic Acid Di-N-Octyl Ester has the function of optimizing low temperature performance.
3. Sebacic Acid Di-N-Octyl Ester has good water resistance and stability.
4. Sebacic Acid Di-N-Octyl Ester has good compatibility with a variety of polymers.
Application：
1. Used in the production of PVC soft products, such as PVC film, artificial leather, plastic shoes, etc.; can also be used to improve the processing performance and low temperature performance of other plastics, such as PVB, PVDC.
2. It can be used as plasticizer and softener in the processing of synthetic rubber, such as nitrile rubber, neoprene rubber and other synthetic rubber products.
3. Adding DOS in rubber seals, hoses, tapes and other rubber products can enhance the elasticity and flexibility of rubber.
4. Adding DOS in coatings can be used in construction coatings, wood coatings, metal coatings and other fields.
5. Used in ink, can improve the printing quality, applicable to a variety of printing processes.
6. Used in insulation layer and sheath material of wire and cable.
7. Add DOS in adhesive, widely used in bonding process in construction, automobile, electronics and other industries.
