Description
Molecular Formula: C21H32O9
Molecular Weight: 428.47
Structural Formula:
Specification:
Items
Specifications
Boiling Point
347°C [at101 325 Pa]
Density
1.064g/mL at 25°C (lit.)
Vapor Pressure
0.003Pa at 20°C
Refractive Index
n20/D1.461(lit.)
Flash Point
>230°F
Water Solubility
1.2g/L at 20℃
Color, APHA
100
Viscosity , CPS.25℃
70~110
Acid value, mgKOH/g
0.5
Tg，℃
18
Polymerization inhibitor, ppm
≤400
Items | Specifications |
Boiling Point | 347°C [at101 325 Pa] |
Density | 1.064g/mL at 25°C (lit.) |
Vapor Pressure | 0.003Pa at 20°C |
Refractive Index | n20/D1.461(lit.) |
Flash Point | >230°F |
Water Solubility | 1.2g/L at 20℃ |
Color, APHA | 100 |
Viscosity , CPS.25℃ | 70~110 |
Acid value, mgKOH/g | 0.5 |
Tg，℃ | 18 |
Polymerization inhibitor, ppm | ≤400 |
Function：
1. Polymerization function, able to carry out free radical polymerization reaction to form a highly cross-linked polymer network structure.
2.The compound has a certain dilution ability. It is an active diluent with little environmental pollution.
3. Flexibility and toughness conferring functions .
4. It can improve the adhesion between polymer and various substrates.
5. Can enhance the chemical resistance of polymer.
Application：
1.UV curing coatings. Widely used in wood coatings, automotive coatings and plastic coatings.
2. Can be used for modification of water-based coatings. It can improve the water resistance and weathering resistance of coatings.
3. In the process of printing and digital printing, its fast curing characteristics enable the ink to dry in an instant.
4. As a UV curing adhesive, it is used for bonding components such as displays and touchscreens and optical components in electronic equipment manufacturing and optical products.
5. Used to modify various polymer materials to make them have better toughness.
6. In the preparation of high-performance composite materials, it can be used as an interface modifier to improve the overall performance of composite materials.
7. Light-curing 3D printing materials can meet the customized demand for complex shaped parts in different fields, such as in the field of medical devices, aerospace parts, consumer electronics and other fields.
