Description
Molecular Formula: C2H8O7P2
Molecular Weight: 206.03
Structural Formula:
Specification:
Items
Specifications
Melting Point
198~199℃
Boiling Point
578.8±60.0°C (Predicted)
Density
1.45(60% aq.)
Acidity coefficient (pKa)
1.35,2.87,7.03,11.3(at 25℃)
Vapor Pressure
0Pa at 25℃
PH
(1.7→100,25 ° C):1.3 ~ 1.8
Stability
Stable. Incompatible with strong oxidants.
Solubility
methanol (slightly soluble), water (slightly soluble)
Active content(HEDP)%
90.0min
Active content(HEDP.H2O)%
98.0min
Chloride(as Cl-)%
50max
Fe,mg/L
5.0max
Phosphoric acid(as PO3³ min.)
0.8max
Phosphoric acid(as PO4³ min)
0.5max
Items | Specifications |
Melting Point | 198~199℃ |
Boiling Point | 578.8±60.0°C (Predicted) |
Density | 1.45(60% aq.) |
Acidity coefficient (pKa) | 1.35,2.87,7.03,11.3(at 25℃) |
Vapor Pressure | 0Pa at 25℃ |
PH | (1.7→100,25 ° C):1.3 ~ 1.8 |
Stability | Stable. Incompatible with strong oxidants. |
Solubility | methanol (slightly soluble), water (slightly soluble) |
Active content(HEDP)% | 90.0min |
Active content(HEDP.H2O)% | 98.0min |
Chloride(as Cl-)% | 50max |
Fe,mg/L | 5.0max |
Phosphoric acid(as PO3³ min.) | 0.8max |
Phosphoric acid(as PO4³ min) | 0.5max |
Function：
1. It has good scale inhibition effect and obvious dissolution limit effect, which can effectively prevent the formation of scale and protect the equipment from scale damage.
2. It can form stable complexes with iron, copper, zinc and other metal ions, forming a protective film on the metal surface, thus playing a role in corrosion inhibition.
3. It can chelate with a variety of metal ions to form a stable complex, which affects the chemical properties and reactivity of metal ions.
4. It can form stable adducts with compounds containing active oxygen to keep active oxygen stable.
Application：
1. Widely used in electric power, chemical industry, metallurgy, fertilizer and other industrial circulating cooling water system, medium and low pressure boiler, oil field water injection and oil pipeline scale and corrosion inhibition.
2. In the textile industry, it can be used as a cleaning agent for metals and non-metals; In the bleaching and dyeing industry, it can be used as peroxide stabilizer and color fixing agent.
3. It is a complexing agent for cyanide-free electroplating industry, which can form stable complexes with metal ions to improve the stability of the plating solution and the quality of the coating.
4. It can be used as a carrier of radioactive elements, and some derivatives also have the potential to fight diseases such as malaria, bringing new hope to the field of medicine.
5. Electronic grade hydroxyethylenediphosphonic acid can be used for grinding, polishing, etching and other process links of semiconductor processing.
6.HEDP solid is a high purity product, suitable for cold winter areas, especially for the electronics industry cleaning agent and daily chemical additives, such as as a soap chelating agent.