Description
Molecular Formula: C20H18O2S3
Molecular Weight: 386.55
Structural Formula:
Specification:
Items
Specifications
Melting Point
64 °C
Boiling Point
527.8±50.0 °C(Predicted)
Density
1.26±0.1 g/cm3(Predicted)
Solubility
soluble in toluene
Refractive Index
1.65
Items | Specifications |
Melting Point | 64 °C |
Boiling Point | 527.8±50.0 °C(Predicted) |
Density | 1.26±0.1 g/cm3(Predicted) |
Solubility | soluble in toluene |
Refractive Index | 1.65 |
Function：
1.4,4′- Dimercaptodiphenyl sulfide bis(methyl methacrylate) is capable of undergoing polymerization reactions to form polymer network structures. This polymerization feature can be used to build polymers with different molecular weights and crosslink densities for a variety of applications.
2. Due to its bifunctional structure, it is an effective crosslinking agent.
3. It can be used for surface modification of other materials.
Application：
1. As a copolymerization monomer added to the synthesis of plastics, it can improve the mechanical properties of plastics, and can be used in the manufacture of automobile parts, electronic equipment shells and other products that require high material properties.
2. In rubber synthesis, it is used as vulcanizing agent or cross-linking agent. This cross-linked rubber can be used in the manufacture of tires, seals and other rubber products that require good elasticity and abrasion resistance.
3. As a functional component of coatings, it can participate in the polymerization and cross-linking reaction in the coating film-forming process. It can improve the hardness, abrasion resistance and chemical resistance of coatings. Used to protect chemical equipment, marine facilities, etc.
4. In adhesive formulations, it can be used as a cross-linking agent to enhance the adhesive bonding strength and durability, and can be used in construction, automobile assembly, furniture manufacturing and other fields.
5. In the photolithography process in the semiconductor manufacturing process, it can be used as a component of photoresist, which is important for the manufacture of high-precision integrated circuits.
6. Used as encapsulation material for electronic components, through polymerization and cross-linking reaction to form encapsulation material with good insulation, sealing and moisture resistance.
7. In tissue engineering, its polymerizable and modifiable properties are used to prepare tissue engineering scaffolds. For example, scaffold materials for bone tissue engineering.
8. As material compositions for drug slow-release carriers, they can be used for the treatment of chronic diseases or diseases that require long-term drug administration.
