Description
Molecular Formula: C20H30O6
Molecular Weight:366.45
MolecularStructure:
Specification:
Items
Specifications
EINECS
221-518-5
Boiling Point
457.21°C (rough estimate)
Vapor Pressure
0Pa at 25°C
Refractive Index
n20/D1.493(lit.)
Flash Point
>230°F
Water Solubility
2mg/L at 20°C
Epoxy equivalent weight
105.0 ~ 120.0 g/Eq
Color (Pt-Co)
≤ 50
Hydrolyzable chloride content
≤ 300ppm
Viscosity at 25℃
≤ 20.0 CPS
Items | Specifications |
EINECS | 221-518-5 |
Boiling Point | 457.21°C (rough estimate) |
Vapor Pressure | 0Pa at 25°C |
Refractive Index | n20/D1.493(lit.) |
Flash Point | >230°F |
Water Solubility | 2mg/L at 20°C |
Epoxy equivalent weight | 105.0 ~ 120.0 g/Eq |
Color (Pt-Co) | ≤ 50 |
Hydrolyzable chloride content | ≤ 300ppm |
Viscosity at 25℃ | ≤ 20.0 CPS |
Function:
1. With high reactivity, it can have ring-opening addition reaction with many kinds of compounds containing active hydrogen to realize the regulation and modification of material properties.
2. Good flexibility and adhesion, enhance the bonding force between materials.
3. Good chemical resistance, able to resist the erosion of acid, alkali, salt and other chemical substances, to improve the service life of the material in harsh chemical environments.
4. The substance has excellent electrical insulation properties after curing, and can effectively prevent the conduction of electric current.
5. It has relatively low toxicity and meets the requirements of environmental protection and safety, but it may decompose and react under high temperature, strong acid and alkali conditions.
Application:
1. As an important intermediate of epoxy resin, it can be used to synthesize high performance epoxy resin. In the field of coatings, adhesives, composites and other applications.
2.The cured product has good stability and safety, and meets the requirements of food contact materials. It can be used for coating of food packaging materials.
3. Because of its light reactivity, it can participate in light curing reaction. Widely used in industrial design, jewelry manufacturing, dental models, cultural creativity, medicine and other fields.
4. It can be used to manufacture electrical and electronic insulating materials, such as insulating paint, insulating potting compound, copper cladding board and so on.
5. Applied to automobile primer, composite materials of automobile parts, such as glass fiber reinforced epoxy resin composite materials.
6. It can be used in the insulation protection of high-voltage cables to improve the service life and reliability of cables.
