Description

Molecular Formula: C6H15NaO6S4
Molecular Weight: 334.41
Structural Formula:

Specification:

Items	Specifications
Density	1.575[at 20℃]
Solubility	Soluble in water
Water solubility	600g/L at 25℃

Function:

1. In the plating process, sodium disulfide dipropanesulfonate can significantly improve the brightness of the coating.
2. It is a good alignment agent.
3. Help to disperse copper ions in the plating solution and prevent copper ions from agglomerating.
4. It can enhance the stability of the plating solution.

Application:

1. It is an indispensable additive in acid copper plating process. Used for copper plating in the printed circuit board (PCB) manufacturing process. ; In the field of metal plating, such as decorative copper plating and functional copper plating (such as improving the electrical conductivity of metal products, corrosion resistance, etc.), it also plays an important role.
2. In the pyrophosphate copper plating system, sodium disulfide dipropanesulfonate can also be used as brightener and positioning agent. It is often used for copper plating of auto parts, mechanical parts, etc.

Please enable JavaScript in your browser to complete this form.

Name or Company Name *

Name Leave or

Email *

Phone or WhatsApp No.

Leave A Messge *

Submit Your Inquiry