Description

Molecular Formula: C22H26O4
Molecular Weight: 354.44
Molecular Structure：

Specification:

Items	Specifications
EINECS	413-900-7
Melting Point	105°C
Boiling Point	473°C
Density	1.149
Flash Point	132°C
Solubility	Soluble in benzene (slight, sonicated), chloroform (slight, heated, sonicated)
Content	≥98.5%( LC)
Volatile Matter	≤0.5
Ash	≤0.2
Epoxy value	≥0.52
Total chlorine	≤ 300ppm

Function：

1. As an active diluent of epoxy resin, it can effectively reduce the viscosity of epoxy resin.
2. It has high reactivity, and can occur ring-opening addition reaction, curing reaction, and improve product performance.
3. It can increase the flexibility of epoxy resin curing material to a certain extent.
4. It has good heat resistance, and the cured material can still maintain good performance under high temperature environment.
5. It has good bonding properties and enhances the bonding force between materials.

Application：

1. As the active diluent and modifier of epoxy resin coating, it is widely used in the surface coating of metal, wood, concrete and other materials.
2. It can be used with epoxy resin to prepare high performance adhesive.
3. In electronics, electrical appliances, electromechanical and mechanical industries, it can be used for potting, casting, impregnation and other processes for the manufacture of electronic components encapsulation materials, insulating paints, potting adhesive and so on.
4. It can be used in the manufacture of glass fiber reinforced epoxy resin composites, carbon fiber reinforced epoxy resin composites, etc., which are widely used in the fields of aerospace, automobile, ship and so on.
5. It can also be used in the preparation of cast plastics, impregnation solution, modeling clay, etc..

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