Description
Molecular Formula: C14H20O4
Molecular Weight: 252.31
Molecular Structure:
Specification:
Items
Specifications
EINECS
219-207-4
Melting Point
-37 °C (lit.)
Boiling Point
355.49°C (rough estimate)
Vapor Pressure
0.002Pa at 25°C
Viscosity (CP)
220~450
Epoxy Equivalent
126~135
Colour (Hazen)
≤50
Purity
≥97%
Density, g/ml
1.150~1.180
Water , % by wt
≤0.2
Total chloride ,ppm
≤100
Items | Specifications |
EINECS | 219-207-4 |
Melting Point | -37 °C (lit.) |
Boiling Point | 355.49°C (rough estimate) |
Vapor Pressure | 0.002Pa at 25°C |
Viscosity (CP) | 220~450 |
Epoxy Equivalent | 126~135 |
Colour (Hazen) | ≤50 |
Purity | ≥97% |
Density, g/ml | 1.150~1.180 |
Water , % by wt | ≤0.2 |
Total chloride ,ppm | ≤100 |
Function：
1. High reactivity, can participate in epoxidation reaction, ester hydrolysis reaction and reaction with nucleophilic reagents such as amines, alcohols, etc., and can be chemically reacted with a variety of compounds, so as to modify the material.
2. It has low viscosity and can effectively reduce the viscosity of the system when used as an additive for resin or coating.
3. Excellent curing performance, the cured product has good heat resistance, chemical resistance and excellent electrical properties.
4. Can be used as a plasticizer, can increase the flexibility and plasticity of the material, but also to maintain a certain degree of mechanical strength and stability.
5. Relatively stable at room temperature, can exist in the air for a period of time without significant decomposition, but sensitive to strong acids, alkalis and high temperature, hydrolysis or decomposition may occur.
Application：
1. It can be used in the manufacture of high-performance coatings, such as as the active diluent of epoxy resin coatings, and can also be used in protective and decorative coatings for automobiles, ships, construction and other fields.
2. It can be used to synthesize high-performance adhesive. In the field of electronics and electrical appliances, it is used in chip encapsulation, circuit board assembly, aerospace, automobile manufacturing and other fields.
3. It can be used in the manufacture of fiber reinforced composites, such as glass fiber reinforced epoxy resin composites, the manufacture of aerospace parts, automotive parts, wind power blades and other high-performance composite products.
4. It can be used in the manufacture of electrical and electronic insulating materials, such as insulating paints, insulating potting compounds, copper-clad laminates, etc., which can ensure the normal operation and safety of electrical and electronic equipment, and improve the reliability and service life of the equipment.
5. As a plasticizer added to plastics, it can improve the flexibility, processing performance and low temperature performance of plastics, so that it is more suitable for different application scenarios, such as wires and cables, tubes, films and other areas of application.
