Description
Molecular Formula:C10H17NO4
Molecular Weight:215.25
Structural Formula:![2-[[(BUTYLAMINO)CARBONYL]OXY]ETHYL ACRYLATE CAS 63225-53-6](http://jinbangch.com/wp-content/uploads/2024/12/2-BUTYLAMINOCARBONYLOXYETHYL-ACRYLATE-CAS-63225-53-6-300x83.gif)
Specification:
Items
Specifications
Boiling Point
327.9±25.0°C(Predicted)
Density
1.06g/mL at 25°C(lit.)
Vapor Pressure
1.29hPa at 25°C(lit.)
Refractive Index
n20/D1.46(lit.)
Flash Point
>230°F
Acidity coefficient(pKa)
12.49±0.46(Predicted)
Water Solubility
4.99g/L at 21°C
Color,Fe-Co
≤100
Acid value, mg KOH/g
≤ 0.5
Viscosity,Mpa.s at 25°C
10~30
MEHQ,ppm
300~500
Items | Specifications |
Boiling Point | 327.9±25.0°C(Predicted) |
Density | 1.06g/mL at 25°C(lit.) |
Vapor Pressure | 1.29hPa at 25°C(lit.) |
Refractive Index | n20/D1.46(lit.) |
Flash Point | >230°F |
Acidity coefficient(pKa) | 12.49±0.46(Predicted) |
Water Solubility | 4.99g/L at 21°C |
Color,Fe-Co | ≤100 |
Acid value, mg KOH/g | ≤ 0.5 |
Viscosity,Mpa.s at 25°C | 10~30 |
MEHQ,ppm | 300~500 |
Function:
1. High reactivity can participate in a variety of chemical reactions.
2. Good dilution, and at the same time in the curing or polymerization process to participate in the reaction, and other components together to form a crosslinked network.
3. Able to interact with the surface of different materials, thus improving the adhesion of the polymer to various substrates.
4. It can reduce the rigidity of polymer and increase its flexibility and elasticity.
Application:
1. It is one of the important monomers for synthesizing high-performance polymer materials, which can be used in the preparation of polyurethane materials, acrylate copolymers and so on.
2. Commonly used in UV curing coatings for furniture, automobiles, electronic products and other surface coating.
3. As an active diluent to reduce the viscosity of the ink, and at the same time participate in the crosslinking reaction to improve the adhesion and abrasion resistance of the ink, suitable for offset printing, gravure printing, silkscreen printing, etc..
4. As a monomer or additive used in the preparation of UV adhesives, widely used in electronics, optics, machinery and other fields of adhesive sealing.
5. Used in the preparation of light-curing 3D printing materials.
6. It can be used for the preparation of thermal interface materials, which can be applied to the 3D printing package of integrated chip circuits and other fields.





