Description
Molecular Formula: C14H20O2
Molecular Weight: 220.31
Structural Formula:
Specification：
Items
Specifications
Boiling Point
289.3±9.0 °C (Predicted)
Density
1.07±0.1 g/cm3(Predicted)
Refractive Index
1.50
Flash Point
117 °C
Specific Gravity (20/20)
1.05
Items | Specifications |
Boiling Point | 289.3±9.0 °C (Predicted) |
Density | 1.07±0.1 g/cm3(Predicted) |
Refractive Index | 1.50 |
Flash Point | 117 °C |
Specific Gravity (20/20) | 1.05 |
Function：
1.1 – Adamantane groups have a unique three-dimensional structure, which makes the material have high hardness and rigidity after curing.
2. Due to the structural stability of 1-Adamantane group, it can maintain the integrity of molecular structure under high temperature environment.
3. The polymer film formed by 1 – adamantyl methacrylate on the surface of the material has high surface hardness and toughness.
4. Its special structure helps to regulate the refractive index and transparency of the material.
5. Enough to resist the erosion of acid, alkali, organic solvents and other chemical substances, to maintain the chemical stability of the material.
Application：
1. Used in the manufacture of optical lenses such as eyeglass lenses, camera lenses, etc. It is suitable for use in a variety of optical instruments and equipment.
2. It can be used as an additive to improve the performance of optical fiber.
3. It is added to automobile top coat to extend the service life of automobile painting.
4. Used in building exterior coatings, protective coatings for industrial equipment and machinery surfaces.
5. Used in the manufacture of high-performance plastic parts in the aerospace field.
6. It can be used in the manufacture of tires, conveyor belts and other rubber products that need to withstand greater friction and long-term use.
Adhesives
7. Used in the preparation of structural adhesives for bonding of structural materials such as metals, ceramics and composites.
8.Used in the encapsulation and bonding of electronic components, for example, in chip encapsulation, circuit board assembly and so on.
